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    首頁產(chǎn)品索引ATA6613C

    ATA6613C

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    ATA6613C

     

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    產(chǎn)品信息

    The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first chip, ATA6624 (LIN-system-basis-chip), has an integrated LIN transceiver, 5V voltage regulator and a window watchdog. The second chip contains the Microchip AVR ATmega168 automotive microcontroller with advanced RISC architecture and??16 Kbytes flash memory. All pins of the LIN-SBC and the microcontroller are bonded out to provide customers the same flexibility for their applications as they have when using discrete parts.

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